E-waste dismantling and recycling facility

Recycling waste circuit boards is a solid waste treatment process that demands high technical expertise and offers significant economic value. Circuit boards contain not only substantial amounts of base metals—such as copper and aluminum—but also precious metals like gold, silver, palladium, and platinum. At the same time, they incorporate complex components, including epoxy resins, glass fibers, and brominated flame retardants.

The whole process for recycling waste circuit boards generally consists of four main stages:

1. Dismantling and Pre-treatment

Thermal Dismantling of Components: Before undergoing heavy-duty shredding, the circuit boards are typically processed using specialized thermal dismantling equipment. Through precise temperature control, the solder is melted, allowing various electronic components (such as chips, capacitors, and connectors) to detach automatically from the board surface, after which they are collected and sorted.

2. Multi-stage Shredding and Mechanical Separation

The pre-treated circuit board substrates are fed into a heavy-duty dual-shaft shredder for primary size reduction, followed by processing in a high-efficiency impact mill or hammer mill.

3. High-Precision Physical Dry Separation process

Utilizing principles of aerodynamics and differences in specific gravity, the material undergoes air-flow classification to separate lighter resin and fiber particles from heavier metal granules.

4. Precious Metal Extraction Process

For high-value fine materials or enriched fractions, specialized hydrometallurgical techniques—such as chemical leaching, ion exchange, or electrolytic deposition—or refining processes are employed to efficiently recover precious metals, including gold (Au), silver (Ag), palladium (Pd), and platinum (Pt).